DescriptionLayerSingle LayerMaterialFR4Board Thinckness1.2MMSize12*9CMSolder MaskGreenSilkscreenWhiteFinish Copper Thinckness35μm/35μmSurface FinishHASLBoard Thinckness Tolerance±10%Impedance Control±10%Warp & Wist0.70%Testing100% Electric Test, IPC Class II.FR4 - Glass laminates are widely used for subtractive Printed Circuit Board fabrication because of their ability to meet a wide variety of processing conditions. Thermally stable copper-clad epoxy-glass laminates offer high mechanical strength and machinability and outstanding electrical characteristics. Designed for single and double-sided boards, they provide a combination of processing flexibility and finished board performance needed for many SMT applications.  HiTg FR4 - A high Tg is very important for the PCBs to guard against barrel cracking and pad fracture during the soldering process.  CEM-1 - Composite Epoxy Material is very similar to FR4. Instead of woven glass fabric a "flies" type is used. CEM-1 is a paper-based laminate with one layer of woven glass fabric. It is not suitable for Plated Through Hole. CEM-1 can only be used for single-layer PCB. Board Thickness - Standard base thickness is 0.062".This is how much copper your board will have on its surface. It is the copper foil thickness, plus plated copper, minus surface preparation. It is given in oz / per sq foot. 1 oz = a minimum of 0.0012"- 0.0014" thickness. We offer finished copper of 1oz. up to 4oz. If you need a different finished copper amount, please note your needs in the additional comments section of the request.This is typically green but we also offer blue, red, and black. We also call it LPI, for Liquid Photo-Imagable solder mask, which is the type we use. It keeps the traces from shorting together when the soldering is done. When no soldermask is requested, we coat the areas of the board not covered with optional solder mask with solder. This is a mix of Tin and Lead.High quality PCB prototypes to productionLead free/RoHS PCBs are availableAll boards are UL approvedAll boards are manufactured under IPC-A-600 specifications and guidelinesAffordable pricingOn time deliveryCircuit Board Materials (FR4, HiTg FR4, Cem-1, Polyimide, etc.)Multilayer printed circuit boardsPrototypes to Full Volume ProductionFlexible Printed Circuit BoardsProducts Details Raw Material FR-4 (Tg 130 available) Layer Count Single SidedBoard Thickness 1.2mmCopper Thickness 1.0ozSurface Finish ENIG(Electroless Nickel Immersion Gold)Solder Mask GreenSilkscreen WhiteMin. Trace Width/Spacing 0.075/0.075mmMin. Hole Size 0.25mmHole Wall Copper Thickness ≥20μmMeasurement 300×400mmPackaging Inner: Vacuum-packed in soft plastic bales  Outer: Cardboard Cartons with double strapsApplication Communication,automobile,cell,computer,medicalAdvantage Competitive Price,Fast Delivery,OEM&ODM,Free Samples,Special Requirements Buried And Blind Via, Impedance Control, Via Plug,  BGA Soldering And Gold Finger Are AcceptableCertification UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE